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Editorial Note for Materials Science: An Indian Journal

Alice A

Editorial Note for Materials Science: An Indian Journal I am pleased to mention that during the year 2019, all issues of volume 17 were published online well within the time and the print issues were also brought out and dispatched within 30 days of publishing the issue online. Materials Science: An Indian Journal during this year also brought out International Conference on Materials Science and Engineering, 25th International Conference on Advanced Materials Science and Engineering & Scientific Exploration on Magnetism and Magnetic Material Research conference proceedings. The JNPPR Impact factor for the year 2018 was 0.50 and ISSN No:0974-7486. During the calendar year 2019, TSMS received a total of 30 papers, out of which 17 articles (57%) were rejected in the preliminary screening due to plagiarism or being out of the format and peer review process. During 2019 around 13 articles were subjected for publication after they are accepted in the peer review process. In the 1 issues of Volume 17 published during the year 2019, a total of 6 articles were published (at process) of which, articles were published from authors all around the world. A total of 110 research scientists from all over the world reviewed the 17 articles published in volume 17. Average publication lag time of an article was further reduced to 2-3 weeks. During the calendar year 2019, a total of 5 Editors, 30 Reviewers joined the board of TSMS and contributed their invaluable services towards contribution as well as publication of articles. I take this opportunity to acknowledge the contribution of Editor-in-ChiefAntti S. korhonenduring the final editing of articles published and the support rendered by the editorial assistant, Prof. Dr. Bien Tan in bringing out issues of TSMS in time. I would also like to express my gratitude to all the authors, reviewers, the publisher, the advisory and the editorial board of TSMS, the office bearers for their support in bringing out yet another volume of TSMS and look forward to their unrelenting support to bring out the Volume 18 of TSMS in scheduled time.