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Effects of alloying elements on physical properties of tin-antimony based lead free solder alloys

Abu Bakr El-Bediwi, Eman Kashita


In order to prevent pollution of the environment with lead the use of tin/ antimony lead free solder alloy with some alloying elements is the best solder alloys for high temperature applications.Also a lower tin content in solder is very important issue because it results in slower intermetallic growth, thinner inter metallic layer, which is because tin reacts with the base metal form an alloy. In this study the effects of alloying elements on structure and some physical properties, such as resistivity, melting temperature, pasty range elastic modulus, hardness and internal friction of tin- antimony lead free solder alloy have been investigated using different experimentalmethods. Sn93Sb5Bi2 alloy has lowest electrical resistivity value compared to the electrical resistivity (34x10-8 .m) of Sn-Pb commercial solder alloy. Sn93Sb5Bi1 alloy has higher elastic modulus value.


索引于

  • 中国社会科学院
  • 谷歌学术
  • 打开 J 门
  • 中国知网(CNKI)
  • 引用因子
  • 宇宙IF
  • 米亚尔
  • 秘密搜索引擎实验室
  • 欧洲酒吧
  • 巴塞罗那大学
  • ICMJE

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