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Microstructure, indentation creep and mechanical properties of Sn-Sb rapidly solidified alloys

A.El-Bediwi, K.M.Ismail, M.Kamal


Microstructure, creep behavior, elastic modulus and internal friction of Sn100-x–Sbx (X=2.2, 10 and 50 wt.%) rapidly solidified alloys have been investigated. Creep behavior of Sn- Sb alloys was studied by long time Vickers indentation testing at room temperature. Stress exponent value of Sn- Sb alloys were determined using Mulheam–Tabor method. Exponents values of Sn- Sb alloys in the range of 5.48–12.57 which in good agreement with the values of Sn based alloys reported in the literature. Elastic modulus of Sn100-x–Sbx (X=2.2, 10 and 50 wt.%) rapidly solidified bearing solder alloys increased but internal friction decreased with Sb content increased.


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  • 中国社会科学院
  • 谷歌学术
  • 打开 J 门
  • 中国知网(CNKI)
  • 引用因子
  • 宇宙IF
  • 电子期刊图书馆
  • 研究期刊索引目录 (DRJI)
  • 秘密搜索引擎实验室
  • ICMJE

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